Thermal Resistance 鈥?/div>
Junction鈥搕o鈥揂mbient (Note 3.)
Total Power Dissipation @ TA = 25擄C
Continuous Drain Current @ 25擄C
Continuous Drain Current @ 70擄C
Pulsed Drain Current (Note 4.)
Operating and Storage
Temperature Range
Single Pulse Drain鈥搕o鈥揝ource Avalanche
Energy 鈥?Starting TJ = 25擄C
(VDD = 鈥?0 Vdc, VGS = 鈥?.5 Vdc, Peak
IL = 鈥?.5 Apk, L = 5 mH, RG = 25
鈩?
Maximum Lead Temperature for Soldering
Purposes, 1/8鈥?from case for 10 seconds
Symbol
VDSS
VGS
R
胃JA
PD
ID
ID
IDM
R
胃JA
PD
ID
ID
IDM
R
胃JA
PD
ID
ID
IDM
TJ, Tstg
EAS
Value
鈥?0
鹵20
171
0.73
鈥?.34
鈥?.87
鈥?.0
100
1.25
鈥?.05
鈥?.44
鈥?2
62.5
2.0
鈥?.86
鈥?.1
鈥?5
鈥?5 to
+150
140
Unit
V
V
擄C/W
W
A
A
A
擄C/W
W
A
A
A
擄C/W
W
A
A
A
擄C
mJ
G
S
MARKING
DIAGRAM
SO鈥?
CASE 751
STYLE 13
1
E3P03
L
Y
WW
= Device Code
= Assembly Location
= Year
= Work Week
8
E3P03
LYWW
PIN ASSIGNMENT
N.C.
Source
Source
Gate
1
2
3
4
8
7
6
5
Drain
Drain
Drain
Drain
Top View
TL
260
擄C
ORDERING INFORMATION
Device
NTMS3P03R2
Package
SO鈥?
Shipping
2500/Tape & Reel
1. Minimum FR鈥? or G鈥?0 PCB, t = Steady State.
2. Mounted onto a 2鈥?square FR鈥? Board (1鈥?sq. 2 oz Cu 0.06鈥?thick single
sided), t = steady state.
3. Mounted onto a 2鈥?square FR鈥? Board (1鈥?sq. 2 oz Cu 0.06鈥?thick single
sided), t
鈮?/div>
10 seconds.
4. Pulse Test: Pulse Width = 300
ms,
Duty Cycle = 2%.
漏
Semiconductor Components Industries, LLC, 2001
1
July, 2001 鈥?Rev. 1
Publication Order Number:
NTMS3P03R2/D
next