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NTMS10P02R2/D Datasheet

  • NTMS10P02R2/D

  • HDTMOS3e Single SO-8

  • 108.51KB

  • 8頁

  • ETC

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NTMS10P02R2
Product Preview
HDTMOS3e Single SO-8
P鈥揅hannel Enhancement鈥揗ode
Power MOSFET
Features
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
鈥?/div>
Ultra Low R
DS(on)
Higher Efficiency Extending Battery Life
Logic Level Gate Drive
Miniature SO鈥? Surface Mount Package
Diode Exhibits High Speed, Soft Recovery
Avalanche Energy Specified
SO鈥? Mounting Information Provided
http://onsemi.com
P鈥揅hannel
D
G
S
Applications
鈥?/div>
Power Management in Portable and Battery鈥揚owered Products, i.e.:
Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS
(T
J
= 25擄C unless otherwise noted)
Rating
Drain鈥搕o鈥揝ource Voltage
Gate鈥搕o鈥揝ource Voltage 鈥?Continuous
Thermal Resistance 鈥?/div>
Junction鈥搕o鈥揂mbient
(1.)
Total Power Dissipation @ T
A
= 25擄C
(1.)
Continuous Drain Current @ 25擄C
(1.)
Continuous Drain Current @ 70擄C
(1.)
Maximum Operating Power Dissipation
(2.)
Maximum Operating Drain Current
(2.)
Pulsed Drain Current
(5.)
Thermal Resistance 鈥?/div>
Junction鈥搕o鈥揂mbient
(4.)
Total Power Dissipation @ T
A
= 25擄C
(3.)
Continuous Drain Current @ 25擄C
(3.)
Continuous Drain Current @ 70擄C
(3.)
Maximum Operating Power Dissipation
(4.)
Maximum Operating Drain Current
(4.)
Pulsed Drain Current
(5.)
Operating and Storage
Temperature Range
Single Pulse Drain鈥搕o鈥揝ource Avalanche
Energy 鈥?Starting T
J
= 25擄C
(V
DD
= 鈥?0 Vdc, V
GS
= 鈥?.5 Vdc,
Peak I
L
= 5.0 Apk, L = 40 mH,
R
G
= 25
鈩?
Maximum Lead Temperature for Soldering
Purposes, 1/8鈥?from case for 10 seconds
Symbol
V
DSS
V
GS
R
胃JA
P
D
I
D
I
D
P
D
I
D
I
DM
R
胃JA
P
D
I
D
I
D
P
D
I
D
I
DM
T
J
, T
stg
E
AS
Value
鈥?0
"12
50
2.5
鈥?0
鈥?.0
0.6
鈥?.5
鈥?0
80
1.6
鈥?.8
鈥?.4
0.4
鈥?.5
鈥?4
鈥?5 to
+150
500
Unit
Vdc
Vdc
擄C/W
W
A
A
W
A
A
擄C/W
W
A
A
W
A
A
擄C
mJ
8
1
SO鈥?
CASE 751
STYLE 12
MARKING DIAGRAM
E10P02
LYWW
E10P02= Device Code
L
= Assembly Location
Y
= Year
WW
= Work Week
PIN ASSIGNMENT
Source
Source
2
3
4
1
8
7
6
5
Drain
Drain
Drain
Drain
T
L
260
擄C
Source
Gate
1. Mounted onto a 2鈥?square FR鈥? Board (1鈥?sq. Cu 0.06鈥?thick single sided),
t = 10 seconds.
2. Mounted onto a 2鈥?square FR鈥? Board (1鈥?sq. Cu 0.06鈥?thick single sided),
t = steady state.
3. Minimum FR鈥? or G鈥?0 PCB, t = 10 seconds.
4. Minimum FR鈥? or G鈥?0 PCB, t = steady state.
5. Pulse Test: Pulse Width < 300
ms,
Duty Cycle < 2%.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
Top View
ORDERING INFORMATION
Device
NTMS10P02R2
Package
SO鈥?
Shipping
2500/Tape & Reel
漏
Semiconductor Components Industries, LLC, 2000
1
August, 2000 鈥?Rev. 1
Publication Order Number:
NTMS10P02R2/D

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