鈥?/div>
Level Shifting
MAXIMUM RATINGS
(T
J
= 25擄C unless otherwise noted)
Parameter
Drain鈭抰o鈭扴ource Voltage
Gate鈭抰o鈭扴ource Voltage
Continuous Drain
Current
Steady
State
t
v
5s
Power Dissipation
Steady
State
t
v
5s
Pulsed Drain Current
T
J
= 25
擄C
T
J
= 85
擄C
T
J
= 25
擄C
T
J
= 25
擄C
T
J
= 85
擄C
T
J
= 25
擄C
I
DM
T
J
,
T
STG
T
L
P
D
Symbol
V
DSS
V
GS
I
D
Value
20
鹵12
3.0
2.2
4.1
1.13
0.59
2.1
12
鈭?5 to
150
260
A
擄C
擄C
W
Unit
V
V
A
D
1
, D
2
G
1
, G
2
S
1
, S
2
N鈭扖hannel MOSFET
ChipFET
CASE 1206A
STYLE 2
t
p
= 10
碌s
Operating Junction and Storage Temperature
Lead Temperature for Soldering Purposes
(1/8鈥?from case for 10 s)
PIN
CONNECTIONS
D
1
8
D
1
7
1 S
1
2 G
1
3 S
2
4 G
2
1
2
3
4
MARKING
DIAGRAM
8
7
6
5
C8
M
THERMAL RESISTANCE RATINGS
Parameter
Junction鈭抰o鈭扐mbient 鈥?Steady State
(Note 1)
Symbol
R
胃JA
Max
110
Unit
擄C/W
D
2
6
D
2
5
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
[1 oz] including traces).
C8 = Specific Device Code
M = Month Code
ORDERING INFORMATION
Device
NTHD4508NT1
NTHD4508NT1G
Package
ChipFET
ChipFET
(Pb鈭扚ree)
Shipping
鈥?/div>
3000/Tape & Reel
3000/Tape & Reel
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2004
1
October, 2004 鈭?Rev. 3
Publication Order Number:
NTHD4508N/D
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