ESD鈭?/div>
HBM
T
J
,
T
STG
I
S
T
L
I
D
2.2
1.6
0.64
12
125
鈭?5 to
150
2.5
260
W
A
V
擄C
A
擄C
A
Symbol
V
DSS
V
GS
I
D
Value
30
鹵20
2.9
2.1
3.9
1.13
W
Unit
V
V
A
D
1
, D
2
G
1
, G
2
S
1
, S
2
N鈭扖hannel MOSFET
ChipFET
CASE 1206A
STYLE 2
PIN
CONNECTIONS
D
1
8
D
1
7
D
2
6
D
2
5
1 S
1
2 G
1
3 S
2
4 G
2
1
2
3
4
MARKING
DIAGRAM
8
7
6
5
C5
M
t
p
= 10
ms
C = 100 pF,
R
S
= 1500
W
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8鈥?from case for 10 s)
C5 = Specific Device Code
M = Month Code
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
(Cu area = 0.214 in sq).
3. ESD Rating Information: HBM Class 0.
ORDERING INFORMATION
Device
NTHD4502NT1
NTHD4502NT1G
Package
ChipFET
ChipFET
(Pb鈭扚ree)
Shipping
鈥?/div>
3000/Tape & Reel
3000/Tape & Reel
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2004
1
October, 2004 鈭?Rev. 4
Publication Order Number:
NTHD4502N/D
1
2
3
4
5
6
