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NTHD4401P Datasheet

  • NTHD4401P

  • Power MOSFET −20 V, −3.0 A, Dual P−Channel...

  • 70.40KB

  • 8頁

  • ONSEMI

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NTHD4401P
Power MOSFET
鈭?0 V, 鈭?.0 A, Dual P鈭扖hannel, ChipFETt
Features
鈥?/div>
Low R
DS(on)
and Fast Switching Speed in a ChipFET Package
鈥?/div>
Leadless ChipFET Package 40% Smaller Footprint than TSOP鈭?
鈥?/div>
ChipFET Package with Excellent Thermal Capabilities where Heat
Transfer is Required
鈥?/div>
Pb鈭扚ree Package is Available
Applications
V
(BR)DSS
鈭?0 V
http://onsemi.com
R
DS(on)
TYP
130 mW @ 鈭?.5 V
I
D
MAX
鈭?.0 A
鈥?/div>
Charge Control in Battery Chargers
鈥?/div>
Optimized for Battery and Load Management Applications in
Portable Equipment
鈥?/div>
MP3 Players, Cell Phones, Digital Cameras, PDAs
鈥?/div>
Buck and Boost DC鈭扗C Converters
G
1
200 mW @ 鈭?.5 V
S
1
S
2
G
2
MAXIMUM RATINGS
(T
J
= 25擄C unless otherwise noted)
Rating
Drain鈭抰o鈭扴ource Voltage
Gate鈭抰o鈭扴ource Voltage
Continuous Drain
Current (Note 1)
Steady
State
t
v
5s
Power Dissipation
(Note 1)
Steady
State
t
v
5s
Pulsed Drain Current
T
A
= 25擄C
T
A
= 85擄C
T
A
= 25擄C
T
A
= 25擄C
T
A
= 85擄C
T
A
= 25擄C
I
DM
T
J
, T
stg
I
S
T
L
P
D
Symbol
V
DSS
V
GS
I
D
Value
鈭?0
"12
鈭?.1
鈭?.5
鈭?.0
1.1
0.6
2.1
鈭?.0
鈭?5 to
150
鈭?.5
260
A
擄C
A
擄C
W
ChipFET
CASE 1206A
STYLE 2
Unit
V
V
A
D
1
P鈭扖hannel MOSFET
D
2
P鈭扖hannel MOSFET
tp = 10
ms
PIN
CONNECTIONS
D
1
8
D
1
7
D
2
6
D
2
5
1 S
1
2 G
1
3 S
2
4 G
2
1
2
3
4
MARKING
DIAGRAM
8
7
6
5
C4
M
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8鈥?from case for 10 s)
THERMAL RESISTANCE RATINGS
Rating
Junction鈭抰o鈭扐mbient 鈭?Steady State (Note 1)
Junction鈭抰o鈭扐mbient 鈭?t
v
5 s
Symbol
R
qJA
Value
110
60
Unit
擄C/W
C4 = Specific Device Code
M = Month Code
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
[1 oz] including traces).
ORDERING INFORMATION
Device
NTHD4401PT1
NTHD4401PT1G
Package
ChipFET
ChipFET
(Pb鈭扚ree)
Shipping
鈥?/div>
3000/Tape & Reel
3000/Tape & Reel
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2004
1
October, 2004 鈭?Rev. 3
Publication Order Number:
NTHD4401P/D

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