鈥?/div>
Power Management in Portable and Battery鈥揚owered Products, i.e.:
Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS
(TJ = 25擄C unless otherwise noted)
Rating
Drain鈥搕o鈥揝ource Voltage
Gate鈥搕o鈥揝ource Voltage 鈥?Continuous
Thermal Resistance
Junction鈥搕o鈥揂mbient (Note 1.)
Total Power Dissipation @ TA = 25擄C
Drain Current 鈥?Continuous @ TA = 25擄C
鈥?Pulsed Drain Current (Tp
t
10
碌S)
Thermal Resistance
Junction鈥搕o鈥揂mbient (Note 2.)
Total Power Dissipation @ TA = 25擄C
Drain Current 鈥?Continuous @ TA = 25擄C
鈥?Pulsed Drain Current (Tp
t
10
碌S)
Thermal Resistance
Junction鈥搕o鈥揂mbient (Note 3.)
Total Power Dissipation @ TA = 25擄C
Drain Current 鈥?Continuous @ TA = 25擄C
鈥?Pulsed Drain Current (Tp
t
10
碌S)
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering
Purposes for 10 Seconds
Symbol
VDSS
VGS
R
胃JA
Pd
ID
IDM
R
胃JA
Pd
ID
IDM
R
胃JA
Pd
ID
IDM
TJ, Tstg
TL
Value
鈥?0
"8.0
244
0.5
鈥?.65
鈥?0
128
1.0
鈥?.35
鈥?4
62.5
2.0
鈥?.3
鈥?0
鈥?5 to
150
260
Unit
Volts
Volts
擄C/W
Watts
Amps
Amps
擄C/W
Watts
Amps
Amps
擄C/W
Watts
Amps
Amps
擄C
擄C
4
5
6
3
1 AMPERE
20 VOLTS
RDS(on) = 90 mW
P鈥揅hannel
1 2 5 6
3
4
MARKING
DIAGRAM
2
1
TSOP鈥?
CASE 318G
STYLE 1
441
W
W
= Work Week
1. Minimum FR鈥? or G鈥?0PCB, operating to steady state.
2. Mounted onto a 2鈥?square FR鈥? board (1鈥?sq. 2 oz. cu. 0.06鈥?thick single
sided), operating to steady state.
3. Mounted onto a 2鈥?square FR鈥? board (1鈥?sq. 2 oz. cu. 0.06鈥?thick single
sided), t
t
5.0 seconds.
PIN ASSIGNMENT
Drain Drain Source
6
5
4
1
2
3
Drain Drain Gate
ORDERING INFORMATION
Device
NTGS3441T1
Package
TSOP鈥?
Shipping
3000 Tape & Reel
漏
Semiconductor Components Industries, LLC, 2000
1
November, 2000 鈥?Rev. 1
Publication Order Number:
NTGS3441T1/D
1
2
3
4
5
6
7
8
