鈥?/div>
Power Management in Portable and Battery鈥揚owered Products, i.e.:
Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS
(TJ = 25擄C unless otherwise noted.)
Rating
Drain鈥搕o鈥揝ource Voltage
Gate鈥搕o鈥揝ource Voltage 鈥?Continuous
Thermal Resistance
Junction鈥搕o鈥揂mbient (Note 1.)
Total Power Dissipation @ TA = 25擄C
Drain Current
鈥?Continuous @ TA = 25擄C
鈥?Pulsed Drain Current (Tp
t
10
碌S)
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Thermal Resistance
Junction鈥搕o鈥揂mbient (Note 2.)
Total Power Dissipation @ TA = 25擄C
Drain Current
鈥?Continuous @ TA = 25擄C
鈥?Pulsed Drain Current (Tp
t
10
碌S)
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering
Purposes for 10 Seconds
Symbol
VDSS
VGS
R
胃JA
Pd
ID
IDM
Pd
ID
R
胃JA
Pd
ID
IDM
Pd
ID
TJ, Tstg
TL
Value
鈥?2
"8.0
62.5
2.0
鈥?.3
鈥?0
1.0
鈥?.35
128
1.0
鈥?.35
鈥?4
0.5
鈥?.65
鈥?5 to
150
260
Unit
Volts
Volts
擄C/W
Watts
Amps
Amps
Watts
Amps
擄C/W
Watts
Amps
Amps
Watts
Amps
擄C
擄C
鈥?.3 AMPERES
鈥?2 VOLTS
75 mW @ VGS = 鈥?.5 V
P鈥揅hannel
1 2 5 6
DRAIN
3
GATE
4
SOURCE
MARKING
DIAGRAM
3
2
1
4
TSOP鈥?
CASE 318G
STYLE 1
433
x
5
6
x
= Date Code
PIN ASSIGNMENT
Drain Drain
Source
6
5
4
1. Mounted onto a 2鈥?square FR鈥? board (1鈥?sq. 2 oz. cu. 0.06鈥?thick single
sided), t
t
5.0 seconds.
2. Mounted onto a 2鈥?square FR鈥? board (1鈥?sq. 2 oz. cu. 0.06鈥?thick single
sided), operating to steady state.
1
2
3
Drain Drain Gate
ORDERING INFORMATION
Device
NTGS3433T1
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
Package
TSOP鈥?
Shipping
3000 Tape & Reel
漏
Semiconductor Components Industries, LLC, 2000
1
December, 2000 鈥?Rev. 0
Publication Order Number:
NTGS3433T1/D