鈥?/div>
Available in 8 mm; 7 inch Tape and Reel
MAXIMUM RATINGS
(T
A
= 25擄C)
Rating
Reverse Voltage
Peak Reverse Voltage
Forward Current
Peak Forward Current
Peak Forward Surge Current
1. t = 1
mS
Symbol
V
R
V
RM
I
F
I
FM
I
FSM
(Note 1)
Value
80
80
100
300
2.0
Unit
Vdc
Vdc
mAdc
mAdc
Adc
6
54
2
3
http://onsemi.com
(3)
(2)
(1)
(4)
(5)
(6)
MARKING
DIAGRAM
1
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Total Device Dissipation
Derate above 25擄C
Thermal Resistance Junction-to-Ambient
Characteristic
(Both Junctions Heated)
Total Device Dissipation
Derate above 25擄C
Thermal Resistance Junction-to-Ambient
Junction and Storage Temperature
2. FR-4 @ Minimum Pad
R
qJA
T
J
, T
stg
T
A
= 25擄C
R
qJA
T
A
= 25擄C
Symbol
P
D
Max
357
(Note 2)
2.9
(Note 2)
350
(Note 2)
Max
500
(Note 2)
4.0
(Note 2)
250
(Note 2)
- 55 to
+150
Unit
mW
mW/擄C
擄C/W
SOT-563
CASE 463A
PLASTIC
P9 D
P9 = Specific Device Code
D = Date Code
ORDERING INFORMATION
Device
Package
SOT-563
SOT-563
Shipping
4 mm pitch
4000/Tape & Reel
2 mm pitch
8000/Tape & Reel
Symbol
P
D
Unit
mW
mW/擄C
擄C/W
擄C
NSDEMP11XV6T1
NSDEMP11XV6T5
ELECTRICAL CHARACTERISTICS
(T
A
= 25擄C)
Characteristic
Reverse Voltage Leakage Current
Forward Voltage
Reverse Breakdown Voltage
Diode Capacitance
Reverse Recovery Time
Symbol
I
R
V
F
V
R
C
D
t
rr
(Note 2)
Condition
V
R
= 70 V
I
F
= 100 mA
I
R
= 100
mA
V
R
= 6.0 V, f = 1.0 MHz
I
F
= 5.0 mA, V
R
= 6.0 V, R
L
= 100
W,
I
rr
= 0.1 I
R
Min
-
-
-0
-
-
Max
0.1
1.2
鈥?/div>
3.5
4.0
Unit
mAdc
Vdc
Vdc
pF
ns
3. t
rr
Test Circuit for NSDEMP11XV6T1 in Figure 4.
漏
Semiconductor Components Industries, LLC, 2003
1
February, 2003 - Rev. 1
Publication Order Number:
NSDEMP11XV6T1/D
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