鈥?/div>
Supply = 2.7鈭?.3 V
Single Supply Operation from 1.8鈭?.5 V
Tiny 2.0 x 1.5 mm Bumped Die
Low Crosstalk,
t鈭?0
dB at 10 mHz
Full 0鈭扸
CC
Signal Handling Capability
High Isolation, 鈭?5 dB at 10 mHz
Low Standby Current,
t50
nA
Low Distortion,
t0.03%
THD
R
ON
Flatness of 1.2
W
Pin for Pin Replacement for MAX4717
Cell Phone
Speaker Switching
Power Switching (Up to 100 mA)
Modems
Automotive
XX = Device Code
D
= Date Code
PIN CONNECTIONS
AND LOGIC DIAGRAM
(Top View)
GND
B
1
NC1
C
1
A
1
NC2
IN1
COM1
NO1
C
2
C
3
C
4
B
4
V+
A
2
A
3
A
4
IN2
COM2
NO2
Applications
FUNCTION TABLE
IN 1, 2
0
1
NO 1, 2
OFF
ON
NC 1, 2
ON
OFF
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
ORDERING INFORMATION
Device
NLAS4717
Package
Microbump鈭?0
Shipping
3000/Tape & Reel
漏
Semiconductor Components Industries, LLC, 2003
1
July, 2003 鈭?Rev. P0
Publication Order Number:
NLAS4717/D