NIS3001A
Integrated Driver and
MOSFET Power Chip for
Synchronous Buck
Controllers
The NIS3001A is an integrated multi鈭抍hip solution for high power
DC to DC synchronous buck converters. It contains two power
MOSFETs that are controlled by an internal Driver. All three die are
packaged in a power QFN package called PInPAK鈩? The
10.5 by 10.5 mm PInPAK鈩?package increases power density and
simplifies PCB layout. The device can be used in single or
multi鈭抪hase applications.
The NIS3001A implements the newest MOSFET technology. The
control MOSFET is designed to provide improved switching
performance and operates at a much lower temperature compared to
discrete solutions. The synchronous MOSFET is designed to reduce
conduction and switching losses at high frequencies. The integrated
solution greatly reduces the parasitic inductance associated with
conventional discrete buck converters and results in the highest
power conversion efficiency.
The power density of the NIS3001A is optimized based on
MOSFET die size and PInPAK design. The PInPAK layout allows for
direct routing into each power terminal. This results in a better
thermal solution for the system. In addition its thermal resistance is
50% lower than BGAs. In summary, the NIS3001A has an improved
efficiency, reliability and scalability for multi鈭抪hase synchronous
buck converters.
Features
http://onsemi.com
MARKING
DIAGRAM
CASE 500
PInPAK
10.5x10.5 PLLP
NIS3001A
AWLYYWW
A
WL
YY
WW
= Assembly Site
= Wafer Lot
= Year
= Work Week
PINOUT DIAGRAM
14 15 16 17
11
12
13
18
19
20
10
7
5
9
8
21
1
2
3
4
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Matched MOSFETs for Optimal Efficiency
10.5 mm x 10.5 mm PInPAK Package
31 A DC Output Current
7.0 to 14 V Input Voltage Range
Internal Thermal Shutdown
Operating Frequency Range up to 1,000 kHz
0.7 V to 5.1 V Output Voltage Range
Nominal Duty Cycle 5 to 50%
6
(Bottom View)
ORDERING INFORMATION
Device
NIS3001AQPT1
Package
PInPAK
Shipping
鈥?/div>
1500/T
ape & Reel
VS
Analog
Driver
IC
Hi Side
Discrete
FETs
Lo Side
Discrete
FETs
VIN
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DRN
PGND
Figure 1.
漏
Semiconductor Components Industries, LLC, 2003
1
October, 2003 鈭?Rev. 1
Publication Order Number:
NIS3001A/D
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Integrated Driver and MOSFET Power Chip for Synchronous Buck...
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