鈩?/div>
@ V
GS
= -10 V.
Industry standard outline SOT-23 surface mount package
using proprietary SuperSOT
TM
-3 design for superior thermal
and electrical capabilities.
High density cell design for extremely low R
DS(ON)
.
Exceptional on-resistance and maximum DC current
capability.
________________________________________________________________________________
D
G
S
Absolute Maximum Ratings
Symbol
V
DSS
V
GSS
I
D
Parameter
Drain-Source Voltage
T
A
= 25擄C unless otherwise noted
NDS352AP
-30
鹵20
(Note 1a)
Units
V
V
A
Gate-Source Voltage - Continuous
Maximum Drain Current - Continuous
- Pulsed
鹵0.9
鹵10
P
D
T
J
,T
STG
Maximum Power Dissipation
(Note 1a)
(Note 1b)
0.5
0.46
-55 to 150
W
Operating and Storage Temperature Range
擄C
THERMAL CHARACTERISTICS
R
胃
JA
R
胃
JC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
250
75
擄C/W
擄C/W
漏 1997 Fairchild Semiconductor Corporation
NDS352AP Rev.D