Thermal Resistance 鈥?/div>
Junction-to-Lead
Junction and Storage Temperature
1. FR鈥? @ Minimum Pad
2. FR鈥? @ 1.0 x 1.0 inch Pad
xx
Symbol
P
D
Max
187 (Note 1.)
256 (Note 2.)
1.5 (Note 1.)
2.0 (Note 2.)
670 (Note 1.)
490 (Note 2.)
Max
250 (Note 1.)
385 (Note 2.)
2.0 (Note 1.)
3.0 (Note 2.)
493 (Note 1.)
325 (Note 2.)
188 (Note 1.)
208 (Note 2.)
鈥?5 to +150
Unit
mW
mW/擄C
擄C/W
xx
= Device Marking
=
(See Page 2)
R
胃JA
Symbol
P
D
Unit
mW
mW/擄C
擄C/W
擄C/W
擄C
DEVICE MARKING INFORMATION
See specific marking information in the device marking table
on page 2 of this data sheet.
R
胃JA
R
胃JL
T
J
, T
stg
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2001
1
January, 2001 鈥?Rev. 6
Publication Order Number:
MUN5311DW1T1/D