Thermal Resistance 鈭?/div>
Junction-to-Lead
Junction and Storage Temperature
1. FR鈭? @ Minimum Pad
2. FR鈭? @ 1.0 x 1.0 inch Pad
Symbol
P
D
Max
187 (Note 1.)
256 (Note 2.)
1.5 (Note 1.)
2.0 (Note 2.)
670 (Note 1.)
490 (Note 2.)
Max
250 (Note 1.)
385 (Note 2.)
2.0 (Note 1.)
3.0 (Note 2.)
493 (Note 1.)
325 (Note 2.)
188 (Note 1.)
208 (Note 2.)
鈭?5 to +150
Unit
mW
mW/擄C
擄C/W
R
胃JA
DEVICE MARKING INFORMATION
Unit
mW
mW/擄C
擄C/W
擄C/W
擄C
Preferred
devices are recommended choices for future use
and best overall value.
See specific marking information in the device marking table
on page 2 of this data sheet.
Symbol
P
D
R
胃JA
R
胃JL
T
J
, T
stg
漏
Semiconductor Components Industries, LLC, 2003
1
December, 2003 鈭?Rev. 5
Publication Order Number:
MUN5211DW1T1/D