Thermal Resistance 鈥?/div>
Junction-to-Lead
Junction and Storage
Temperature Range
1. FR鈥? @ Minimum Pad
2. FR鈥? @ 1.0 x 1.0 inch Pad
Symbol
P
D
Max
202 (Note 1.)
310 (Note 2.)
1.6 (Note 1.)
2.5 (Note 2.)
618 (Note 1.)
403 (Note 2.)
280 (Note 1.)
332 (Note 2.)
鈥?5 to +150
Unit
mW
mW/擄C
擄C/W
擄C/W
擄C
8x = Specific Device Code
x = (See Marking Table)
M = Date Code
8x M
MARKING DIAGRAM
R
胃JA
R
胃JL
T
J
, T
stg
DEVICE MARKING INFORMATION
See specific marking information in the device marking table
on page 2 of this data sheet.
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2001
1
January, 2001 鈥?Rev. 4
Publication Order Number:
MUN5211T1/D