鈮?/div>
50
碌s)
Drain Current 鈥?Continuous
Drain Current
鈥?Pulsed
Total Power Dissipation @ T
C
= 25擄C
Derate above 25擄C
Total Power Dissipation @ T
A
= 25擄C
Derate above 25擄C (Note 1)
Total Power Dissipation @ T
A
= 25擄C (1)
Derate above 25擄C (Note 2)
Operating and Storage Junction Temper-
ature Range
Symbol
V
DSS
V
DGR
V
GS
V
GSM
I
D
I
DM
P
D
P
D
P
D
T
J
, T
stg
Value
150
150
鹵
20
鹵
40
6.0
20
20
0.16
1.25
0.01
1.75
0.014
鈭?5 to
+150
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Watts
W/擄C
Watts
W/擄C
Watts
W/擄C
擄C
1
Gate
6N15
Y
WW
CASE 369C
DPAK
(Surface Mount)
STYLE 2
1 2
3
1
3
CASE 369D
DPAK
(Straight Lead)
STYLE 2
2
V
(BR)DSS
150 V
http://onsemi.com
R
DS(on)
MAX
0.3
W
N鈭扖HANNEL
D
I
D
MAX
6.0 A
G
S
4
4
MARKING DIAGRAM
& PIN ASSIGNMENTS
4 Drain
YWW
T
6N15
4 Drain
YWW
T
6N15
3
Source
1
Gate
2
Drain
3
Source
Package
DPAK
DPAK
Straight Lead
DPAK
Shipping
鈥?/div>
75 Units/Rail
75 Units/Rail
2500 Tape & Reel
Publication Order Number:
MTD6N15/D
2
Drain
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance
鈭?Junction to Case
鈭?Junction to Ambient (Note 1)
鈭?Junction to Ambient (Note 2)
Symbol
R
胃JC
R
胃JA
R
胃JA
Value
6.25
100
71.4
Unit
擄C/W
= Device Code
= Year
= Work Week
ORDERING INFORMATION
Device
MTD6N15
MTD6N15鈭?
MTD6N15T4
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
2. When surface mounted to an FR4 board using 0.5 sq. in. drain pad size.
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
漏
Semiconductor Components Industries, LLC, 2004
1
March, 2004 鈭?Rev. 2
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