Total Power Dissipation @ TC = 25擄C, when mounted to minimum recommended pad size
鈩?/div>
廬
G
S
Symbol
VDSS
VDGR
VGS
VGSM
ID
ID
IDM
PD
CASE 369A鈥?3, Style 2
DPAK Surface Mount
Value
500
500
鹵
20
鹵
40
1.0
0.8
4.0
50
0.4
1.75
鈥?55 to 150
Unit
Vdc
Vdc
Vdc
Adc
Apk
Watts
W/擄C
Watts
擄C
TJ, Tstg
UNCLAMPED DRAIN鈥揟O鈥揝OURCE AVALANCHE CHARACTERISTICS
(TJ < 150擄C)
Single Pulse Drain鈥搕o鈥揝ource Avalanche Energy 鈥?Starting TJ = 25擄C
(VDD = 100 Vdc, VGS = 10 Vdc, Peak IL = 3.0 Apk, L = 10 mH, RG = 25
鈩?
EAS
45
mJ
THERMAL CHARACTERISTICS
Thermal Resistance 鈥?Junction to Case
Thermal Resistance
鈥?Junction to Ambient
Thermal Resistance
鈥?Junction to Ambient (1)
Maximum Lead Temperature for Soldering Purposes, 1/8鈥?from case for 5 seconds
(1) When surface mounted to an FR4 board using the minimum recommended pad size.
R
胃JC
R
胃JA
R
胃JA
TL
2.5
100
71.4
260
擄C/W
擄C
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
E鈥揊ET and Designer鈥檚 are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Preferred
devices are Motorola recommended choices for future use and best overall value.
漏
Motorola TMOS
Motorola, Inc. 1996
Power MOSFET Transistor Device Data
1
1
2
3
4
