鈮?/div>
10
碌s)
Symbol
VDSS
VDGR
VGS
ID
ID
IDM
PD
Value
60
60
鹵15
50
28
142
125
1.0
2.5
鈥?55 to 150
400
1.0
62.5
50
260
Unit
Vdc
Vdc
Vdc
Adc
Apk
Watts
W/擄C
Watts
擄C
mJ
擄C/W
Total Power Dissipation
Derate above 25擄C
Total Power Dissipation @ TA = 25擄C, when mounted with the minimum recommended pad size
Operating and Storage Temperature Range
Single Pulse Drain鈥搕o鈥揝ource Avalanche Energy 鈥?Starting TJ = 25擄C
(VDD = 25 Vdc, VGS = 5.0 Vpk, IL = 50 Apk, L = 0.32 mH, RG = 25
鈩?/div>
)
Thermal Resistance 鈥?Junction to Case
Thermal Resistance
鈥?Junction to Ambient
Thermal Resistance
鈥?Junction to Ambient, when mounted with the minimum recommended pad size
Maximum Lead Temperature for Soldering Purposes, 1/8鈥?from case for 10 seconds
TJ, Tstg
EAS
R
胃JC
R
胃JA
R
胃JA
TL
擄C
This document contains information on a new product. Specifications and information herein are subject to change without notice.
E鈥揊ET, Designer鈥檚 and L2TMOS are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred
devices are Motorola recommended choices for future use and best overall value.
REV 1
漏
Motorola TMOS Power MOSFET Transistor Device Data
Motorola, Inc. 1994
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