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CMOS imaging technology
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power disable switch for reduced standby current
On-die phase lock loop (PLL)
Programmable I/O slew rate
2 x 2 pixel binning
Simple two-wire serial programming interface
ITU-R BT.656 (YCbCr), 565RGB, 555RGB, or 444RGB
formats (progressive scan)
System-on-chip (SOC)鈥攁 completely integrated
camera system
Ultra low-power, low-cost, progressive scan CMOS
image sensor
1.3-megapixel resolution (1,280H x 1,024V)
1/4-inch optical format
15 frames per second (fps) at full resolution
Superior low-light performance
On-die image 鏗俹w processor performs sophisticated
processing: color recovery and correction, sharpening,
gamma, lens shading correction, and on-the-鏗倅
defect correction
Mechanical shutter support
Filtered image downscaling to arbitrary size with
smooth, continuous zoom and pan
device that simpli鏗乪s the camera module design, re-
lated manufacturing processes, system integration,
power management, and component count. It in-
corporates sophisticated camera functions on-chip
and is programmable through a simple two-wire se-
rial interface. This yields more space and makes the
sensor easier to design with. Additionally, this de-
vice enables mobile phone manufacturers to simply
upgrade their existing 1/4-inch VGA cameras to 1/4-
inch megapixel cameras, occupying the same height
and footprint.
Enhanced Capabilities
The device features 2 x 2 pixel binning, programma-
ble input/output slew rate, mechanical shutter sup-
port, and continuous, smooth zoom and pan, as well
as day and night mode con鏗乬urations. It has three-
channel gamma correction, lens shading correction,
and color correction. The camera control sequencer
automates the camera鈥檚 鏗俛sh and video clip snap-
shots. The device also has an on-board PLL and sup-
ports pixel binning as an enhanced form of image
size reduction.
Getting the Picture鈥n Style
Mobile applications with small form factors are in
demand, and not surprisingly, customers are ex-
pecting to 鏗乶d more features in their new slimmer,
sleeker cell phones. They want to snap a photo at
the family picnic or capture a good time with friends
at a party. The 1/4-inch, 1.3-megapixel SOC image
sensor opens the door to slim designs that take
great pictures. Its specially engineered microlenses
produce high-quality images and enable low-pro鏗乴e
camera modules.
You Get a Complete Solution
The MT9M112 is sure to improve your designs, as
will working with Micron. In addition to high-qual-
ity products, you鈥檒l also get the added advantages
of doing business with a top-tier supplier: advanced
technology, worldwide facilities, technical exper-
tise, and sales support鈥攁 superior solution from an
industry leader.
Samples for this device are available now, and pro-
duction will commence in December of 2005. For
more information or to order the MT9M112, call
your Micron Imaging representative or visit Micron鈥檚
Web site at
www.micron.com/imaging.
Focused on Design
The MT9M112 is a fully integrated system-on-chip
(SOC) sensor, incorporating additional logic on the
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