鈥?/div>
Platinum/Tungsten schottky barrier for low forward voltage drop
Oxide passivated structure for very low leakage currents
Guard ring protection for increased reverse energy capability
Epitaxial structure minimizes forward voltage drop
Hermetically sealed, low profile ceramic surface mount power package
Low package inductance
Very low thermal resistance
TXV-level (MSASC150H45AV) or S-level (MSASC150H45AS)
screening i.a.w. Microsemi Internal Procedure PS 11.50 available
LOW VOLTAGE
DROP SCHOTTKY
DIODE
Maximum Ratings @ 25擄 C (unless otherwise specified)
擄
DESCRIPTION
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current, Tc鈮?135擄C
derating, forward current, Tc鈮?135擄C
Nonrepetitive Peak Surge Current, tp= 8.3 ms, half-sinewave
Peak Repetitive Reverse Surge Current, tp= 1碌s, f= 1kHz
Junction Temperature Range
Storage Temperature Range
Thermal Resistance, Junction to Case
SYMBOL
V
RRM
V
RWM
V
R
I
F(ave)
dI
F
/dT
I
FSM
I
RRM
T
j
T
stg
胃
JC
MAX.
45
45
45
150
(3.75)
500
2
-65 to +175
-65 to +175
0.25
UNIT
Volts
Volts
Volts
Amps
Amps/擄C
Amps
Amp
擄C
擄C
擄C/W
Mechanical Outline
Datasheet# MSC0876.PDF