鈥?/div>
DESIGNED FOR HIGH POWER PULSED IFF
720 WATTS (min.) IFF 1030 or 1090 MHz
REFRACTORY GOLD METALLIZATION
6.8 dB MIN. GAIN
LOW THERMAL RESISTANCE FOR RELIABILTY AND
RUGGEDNESS
30:1 LOAD VSWR CAPABILITY AT SPECIFIED
OPERATING CONDITIONS
INPUT MATCHED, COMMON BASE CONFIGURATION
DESCRIPTION:
The MS2475 is a silicon NPN power transistor designed for IFF
applications. The MS2475 is designed to exceed the high peak
power requirements of today's IFF systems. Hermetic sealing,
gold metalization and internal input matching provide superior
long term reliability and broadband performance.
ABSOLUTE MAXIMUM RATINGS
(Tcase = 25擄C)
擄
Symbol
V
CC
I
C
P
DISS
T
J
T
STG
Parameter
Collector-Supply Voltage*
Device Current*
(T
C
鈮?/div>
100擄C)
擄
Power Dissipation*
Junction Temperature
Storage Temperature
Value
55
45
1670
+200
- 65 to + 200
Unit
V
A
W
擄
C
擄
C
Thermal Data
R
TH(j-c)
Junction-Case Thermal Resistance*
0.06
擄
C/W
* Applies only to rated RF operation.
MSC0937A.DOC 10-20-98
next