鈥?/div>
REFRACTORY/GOLD METALLIZATION
EMITTER SITE BALLASTED
LOW THERMAL RESISTANCE
INPUT/OUTPUT MATCHING
OVERLAY GEOMETRY
METAL/CERAMIC HERMETIC PACKAGE
P
OUT
= 150 W MIN. WITH 7.5 dB Gain
DESCRIPTION:
The MS2215 is designed for specialized avionics applications,
including Mode-S, TCAS and JTIDS where power is provided
under pulse formats utilizing short pulse widths and high burst or
overall duty cycles.
ABSOLUTE MAXIMUM RATINGS
(Tcase = 25擄C)
擄
Symbol
P
DISS
I
C
V
CC
T
J
T
STG
Power Dissipation *
(T
C
鈮?/div>
擄C)
Device Current *
Collector - Supply Voltage *
Junction Temperature (Pulsed RF Operation)
Storage Temperature *
Parameter
Value
300
16.5
35
250
- 65 to + 200
Unit
A
V
擄
C
擄
C
Thermal Data
R
TH(j-c)
Junction-Case Thermal Resistance *
0.57
擄
C/W
* Applies only to rated RF amplifier operation
MSC0921.PDF 9-23-98
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