鈥?/div>
REFRACTORY/GOLD METALLIZATION
EMITTER SITE BALLASTED
15:1 VSWR CAPABILITY
LOW RF THERMAL RESISTANCE
INPUT/OUTPUT MATCHING
OVERLAY GEOMETRY
METAL/CERAMIC HERMETIC PACKAGE
P
OUT
= 30 W MIN. WITH 7.8 dB Gain
DESCRIPTION:
The MS2213 device is a high power Class C transistor specifically
designed for JTIDS pulsed output and driver applications.
The device is capable of operation over a wide range of pulse
widths, duty cycles and temperatures and is capable of
withstanding 15:1 output VSWR at rated RF conditions.
Low RF thermal resistance and computerized automatic wire
bonding techniques ensure high reliability and product
consistency.
The MS2213 is supplied in the hermetic metal/ceramic package
with internal input matching structures.
A
BSOLUTE MAXIMUM RATINGS
(Tcase = 25擄C)
擄
Symbol
P
DISS
I
C
V
CC
T
J
T
STG
Power Dissipation *
(T
C
鈮?/div>
85擄C)
擄
Device Current *
Collector - Supply Voltage *
Junction Temperature (Pulsed RF Operation)
Storage Temperature
Parameter
Value
75
3.5
40
250
- 65 to + 200
Unit
W
A
V
擄
C
擄
C
Thermal Data
R
TH(j-c)
Junction-Case Thermal Resistance
2.2
擄
C/W
* Applies only to rated RF amplifier operation
MSC0920.PDF 9-23-98
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