鈥?/div>
REFRACTORY/GOLD METALLIZATION
EMITTER SITE BALLASTED
5:1 VSWR CAPABILITY
LOW THERMAL RESISTANCE
INPUT/OUTPUT MATCHING
OVERLAY GEOMETRY
METAL/CERAMIC HERMETIC PACKAGE
P
OUT
= 6.0 W MIN. WITH 9.3 dB Gain
DESCRIPTION:
The MS2211 is designed for specialized avionics applications,
including JTIDS, where power is provided under pulse formats
utilizing short pulse widths and high burst or overall duty cycles.
ABSOLUTE MAXIMUM RATINGS
(Tcase = 25擄C)
擄
Symbol
P
DISS
I
C
V
CC
T
J
T
STG
Power Dissipation *
(T
C
鈮?/div>
75擄C)
擄
Device Current *
Collector - Supply Voltage *
Junction Temperature (Pulsed RF Operation)
Storage Temperature
Parameter
Value
25
0.9
32
250
- 65 to + 200
Unit
W
A
V
擄
C
擄
C
Thermal Data
R
TH(j-c)
Junction-Case Thermal Resistance *
7.0
擄
C/W
* Applies only to rated RF amplifier operation
MSC0919.PDF 9-23-98
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