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Durable Epoxy Unibody Element
BASIC CHIP
CARRIER ELEMENT
CASE 867鈥?8, STYLE 1
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 700 kPa (0 to 101.5 psi)
0.2 to 4.7 V OUTPUT
VS
3
X鈥揹ucer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
2
GND
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
1
Vout
DIFFERENTIAL
PORT OPTION
CASE 867C鈥?5, STYLE 1
PINS 4, 5 AND 6 ARE NO CONNECTS
PIN NUMBER
1
2
3
Vout
Gnd
VS
4
5
6
N/C
N/C
N/C
Figure 1. Fully Integrated Pressure Sensor Schematic
MAXIMUM RATINGS(1)
v
1 Atmosphere)
Burst Pressure (P2
v
1 Atmosphere)
Overpressure (P2
Storage Temperature
Operating Temperature
Parametrics
Symbol
P1max
P1burst
Tstg
TA
Value
2800
5000
鈥?40 to +125
鈥?40 to +125
Unit
kPa
kPa
擄C
擄C
NOTE: Pins 4, 5, and 6 are internal
device connections. Do not connect
to external circuitry or ground. Pin 1
is noted by the notch in the Lead.
1. TC = 25擄C unless otherwise noted. Maximum Ratings apply to Case 867鈥?8 only.
2. Extended exposure at the specified limits may cause permanent damage or degradation to the device.
3. This sensor is designed for applications where P1 is always greater than, or equal to P2.
Senseon and X鈥揹ucer are trademarks of Motorola, Inc.
REV 2
Motorola Sensor Device Data
漏
Motorola, Inc. 1997
1