鈮?/div>
10
m
S)
Total Power Dissipation @ TC = 25擄C
Derate above 25擄C
Total PD @ TA = 25擄C mounted on 1鈥?Sq. Drain Pad on FR鈥? Bd. Material
Total PD @ TA = 25擄C mounted on 0.7鈥?Sq. Drain Pad on FR鈥? Bd. Material
Total PD @ TA = 25擄C mounted on min. Drain Pad on FR鈥? Bd. Material
Operating and Storage Temperature Range
Symbol
VDSS
VDGR
VGS
VGSM
ID
ID
IDM
PD
MMFT2N25E
TMOS POWER FET
2.0 AMPERES
250 VOLTS
RDS(on) = 3.5
W
廬
4
2,4
D
1
2
3
1
G
S
3
CASE 318E鈥?4, STYLE 3
TO鈥?61AA
Value
250
250
鹵
20
鹵
40
2.0
0.6
7.0
0.77
6.2
1.0
1.2
0.8
鈥?55 to 150
Unit
Vdc
Vdc
Vdc
Vdc
Adc
Apk
Watts
mW/擄C
Watts
TJ, Tstg
擄C
UNCLAMPED DRAIN鈥揟O鈥揝OURCE AVALANCHE CHARACTERISTICS (TJ < 150擄C)
Single Pulse Drain鈥搕o鈥揝ource Avalanche Energy 鈥?Starting TJ = 25擄C
(VDD = 80 V, VGS = 10 V, Peak IL= 4.0 Apk, L = 3.0 mH, RG = 25
鈩?
EAS
26
mJ
THERMAL CHARACTERISTICS
鈥?Junction鈥搕o鈥揂mbient on 1鈥?Sq. Drain Pad on FR鈥? Bd. Material
鈥?Junction鈥搕o鈥揂mbient on 0.7鈥?Sq. Drain Pad on FR鈥? Bd. Material
鈥?Junction鈥搕o鈥揂mbient on min. Drain Pad on FR鈥? Bd. Material
Maximum Lead Temperature for Soldering Purposes, 1/8鈥?from case for 10 seconds
R
胃JA
90
103
162
260
擄C/W
TL
擄C
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
TMOS is a registered trademark of Motorola, Inc.
E鈥揊ET is a trademark of Motorola, Inc.
漏
Motorola TMOS Power MOSFET Transistor Device Data
Motorola, Inc. 1997
1