鈥?/div>
The SOT鈥?23 Package can be soldered using wave or reflow.
The formed leads absorb thermal stress during soldering
eliminating the possibility of damage to the die.
MAXIMUM RATINGS
(TC = 25擄C unless otherwise noted)
Rating
Drain鈥搕o鈥揝ource Voltage
Gate鈥搕o鈥揝ource Voltage 鈥?Non鈥揜epetitive
Drain Current
Total Power Dissipation @ TA = 25擄C
(Note 1.)
Derate above 25擄C
Operating and Storage Temperature
Range
Symbol
VDSS
VGS
ID
PD
Value
200
鹵20
250
0.8
6.4
TJ, Tstg
鈥?5 to
150
Unit
Volts
Volts
mAdc
Watts
mW/擄C
擄C
1
4
http://onsemi.com
250 mA
200 VOLTS
RDS(on) = 14
W
N鈥揅hannel
D
G
S
MARKING
DIAGRAM
THERMAL CHARACTERISTICS
Thermal Resistance 鈥?/div>
Junction鈥搕o鈥揂mbient
Maximum Temperature for Soldering
Purposes
Time in Solder Bath
R
胃JA
TL
260
10
156
擄C/W
2
3
TO鈥?61AA
CASE 318E
STYLE 3
FT107
LWW
擄C
Sec
L
WW
= Location Code
= Work Week
1. Device mounted on FR鈥? glass epoxy printed circuit using minimum
recommended footprint.
PIN ASSIGNMENT
4
Drain
1
2
3
Gate
Drain
Source
ORDERING INFORMATION
Device
MMFT107T1
MMFT107T3
Package
SOT鈥?23
SOT鈥?23
Shipping
1000 Tape & Reel
4000 Tape & Reel
Preferred
devices are recommended choices for future use
and best overall value.
漏
Semiconductor Components Industries, LLC, 2000
1
November, 2000 鈥?Rev. 4
Publication Order Number:
MMFT107T1/D
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