SPICE MODEL: MMDT5551
MMDT5551
DUAL NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
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Epitaxial Planar Die Construction
Complementary PNP Type Available (MMDT5401)
Ideal for Medium Power Amplification and Switching
Ultra-Small Surface Mount Package
Lead Free/RoHS Compliant (Note 3)
E
2
B
2
C
1
C
2
A
B
1
E
1
SOT-363
Dim
A
B C
Min
0.10
1.15
2.00
0.30
1.80
戮
0.90
0.25
0.10
0擄
Max
0.30
1.35
2.20
0.40
2.20
0.10
1.00
0.40
0.25
8擄
B
C
D
F
M
Mechanical Data
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K
G
H
0.65 Nominal
H
J
K
L
M
a
Case: SOT-363
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed
over Alloy 42 leadframe).
Terminal Connections: See Diagram
Marking (See Page 2): K4N
Ordering & Date Code Information: See Page 2
Weight: 0.006 grams (approx.)
E
2
B
2
C
1
C
2
B
1
E
1
J
D
F
L
All Dimensions in mm
Maximum Ratings
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
@ T
A
= 25擄C unless otherwise specified
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
d
R
qJA
T
j
, T
STG
Value
180
160
6.0
200
200
625
-55 to +150
Unit
V
V
V
mA
mW
擄C/W
擄C
Characteristic
Collector Current - Continuous (Note 1)
Power Dissipation (Note 1, 2)
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage and Temperature Range
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Maximum combined dissipation.
3. No purposefully added lead.
DS30172 Rev. 7 - 2
1 of 4
www.diodes.com
MMDT5551
茫
Diodes Incorporated
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