鈮?/div>
10
碌s)
Source Current 鈥?Continuous @ TA = 25擄C
Total Power Dissipation @ TA = 25擄C (1)
Operating and Storage Temperature Range
Single Pulse Drain鈥搕o鈥揝ource Avalanche Energy 鈥?Starting TJ = 25擄C
(VDD = 30 Vdc, VGS = 5.0 Vdc, VDS = 20 Vdc, IL = 9.0 Apk, L = 10 mH, RG = 25
W
)
Thermal Resistance 鈥?Junction鈥搕o鈥揂mbient
Maximum Lead Temperature for Soldering Purposes, 1/8鈥?from Case for 10 sec.
Symbol
VDSS
VGS
ID
IDM
IS
PD
TJ, Tstg
EAS
R
胃JA
TL
Value
30
鹵
20
4.0
20
1.7
2.0
鈥?55 to 150
450
62.5
260
Unit
Vdc
Vdc
Adc
Apk
Adc
Watts
擄C
mJ
擄C/W
擄C
DEVICE MARKING
D4P03
(1) Mounted on G10/FR4 glass epoxy board using minimum recommended footprint.
ORDERING INFORMATION
Device
MMDF4P03HDR2
Reel Size
13鈥?/div>
Tape Width
12 mm embossed tape
Quantity
2500
This document contains information on a new product. Specifications and information herein are subject to change without notice.
HDTMOS is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Preferred
devices are Motorola recommended choices for future use and best overall value.
漏
Motorola TMOS Power MOSFET Transistor Device Data
Motorola, Inc. 1997
1
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