MCC
Features
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Low Leakage
omponents
21201 Itasca Street Chatsworth
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MMBD1501(A)
THRU
MMBD1505(A)
High Conductance
Low Leakage Diode
350mW
SOT-23
A
D
Surface Mount Package Ideally Suited for Automatic Insertion
150 C Junction Temperature
High Conductance
o
Mechanical Data
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Case: SOT-23, Molded Plastic
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Terminals: Solderable per MIL-STD-202, Method 208
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Polarity: See Diagram
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Weight: 0.008 grams ( approx.)
C
B
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Characteristic
Working Inverse Voltage
DC Forward Current
Average Rectified Current
Recurrent Peak Forward Current
Peak Forward Surge Current @ t=1.0s
@t=1.0ms
Power Dissipation
Thermal Resistance
Operation & Storage Temp. Range
Symbol
V
IV
I
F
Io
i
f
i
f(surge)
Pd
R
Tj, T
STG
Value
180
600
200
700
1.0
2.0
350
357
-55 to +150
o
Unit
V
mA
mA
mA
A
mW
C/W
o
F
E
G
H
J
K
DIMENSIONS
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
C
Note:
1)
These ratings are based on a max. junction temperature of 150 degrees C
2)
These are steady state limits. T he factory should be consulted on applications
involving pulsed or low duty cycle operation
Electrical Characteristics @ 25
o
C Unless Otherwise Specified
Charateristic
Breakdown Voltage
Symbol
B
V
Min
200
620
720
800
0.83
0.87
0.9
750
850
950
1.1
1.3
1.5
1.0
3.0
10
5.0
4
Max
Unit
V
mV
mV
mV
V
V
V
nA
uA
nA
uA
pF
Test Cond.
I
R
=5.0uA
I
F
=1.0mA
I
F
=10mA
I
F
=50mA
I
F
=100mA
I
F
=200mA
I
F
=300mA
V
R
=125V
o
V
R
=125V T
A
=150 C
V
R
=180V
o
V
R
=180V T
A
=150 C
V
R
=0V, f=1.0MHz
DIM
A
B
C
D
E
F
G
H
J
K
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
Forward Voltage Drop
V
F
Reverse Current
I
R
-----
.037
.950
.037
.950
Junction Capacitance
Cj
-----
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