Package information - MLP322
Surface mounted, 3 pin package
Package outline
e
L2
4x 1
b
e
Detail A
L
D4
E
b1
E4
Detail A
E2
L2
D
r
D2
bottom view
A
A2
A3
A1
DIM
A
A1
A2
A3
b
b1
D
D2
D4
Millimeters
Min.
0.80
0.00
0.65
0.15
0.18
0.17
1.22
0.56
Max.
1.00
0.05
0.75
0.25
0.28
0.30
1.42
0.76
Inches
Min.
0.0315
0.00
0.0255
0.0059
0.0070
0.0066
0.0480
0.0220
Max.
0.0393
0.002
0.0295
0.0098
0.0110
0.0118
0.0559
0.0299
DIM
e
E
E2
E4
L
L2
r
-
Millimeters
Min.
Max.
0.65 REF.
2.00 BSC
0.79
0.48
0.20
0.99
0.68
0.45
Inches
Min.
Max.
0.0255 REF.
0.0787 BSC
0.031
0.0188
0.0078
0.039
0.0267
0.0177
0.125 MAX.
0.075 BSC
0擄
-
12擄
-
0.005 REF.
0.0029 BSC
0擄
-
12擄
-
2.00 BSC
0.0787 BSC
Note:
Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Soldering footprint
2.65
0.1043
1.60
0.0630
0.35
0.0138
1.35
0.0531
0.35
0.0138
0.75
0.0295
0.80
1.20
2.70
0.0315 0.0472
0.1063
0.35
0.0138
2.65
0.1043
mm
inches
0.65
0.0256
Issue 2 - October 2005
漏 Zetex Semiconductors plc 2005
1
www.zetex.com