Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating: Plastic 鈥淧 and D/DW鈥?/div>
Packages: 鈥?7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high鈭抜mpedance circuit. For proper operation, V
in
and V
out
should be constrained
to the range V
SS
v
(V
in
or V
out
)
v
V
DD
.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either V
SS
or V
DD
). Unused outputs must be left open.
SOIC鈭?6 1000/Tape & Reel
(Pb鈭扚ree)
鈥燜or information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb鈭扚ree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
漏
Semiconductor Components Industries, LLC, 2006
1
June, 2006 鈭?Rev. 6
Publication Order Number:
MC14517B/D