B鈥?+ A鈥?B鈥?/div>
16
1
PDIP鈭?6
P SUFFIX
CASE 648
1
MC10H180P
AWLYYWWG
3
14
1
11
10
12
13
1 20
20 1
V
CC
S0
S1
C
OUT
C
IN
A1
B1
SEL
B
A
WL, L
YY, Y
WW, W
G
PLLC鈭?0
FN SUFFIX
CASE 775
DIP PIN ASSIGNMENT
S1
S0
COUT
C
IN
A0
B0
SEL
A
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
10H180G
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb鈭扚ree Package
Pin assignment is for Dual鈭抜n鈭扡ine Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional marking information, refer to
Application Note AND8002/D.
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
漏
Semiconductor Components Industries, LLC, 2006
February, 2006
鈭?/div>
Rev. 7
1
Publication Order Number:
MC10H180/D
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