鈥?/div>
Pb鈭扚ree Packages are Available*
Inputs
E
H
L
L
L
A
X
B
X
16
16
1
Outputs
PDIP鈭?6
P SUFFIX
CASE 648
1
MC10H166P
AWLYYWWG
TRUTH TABLE
A<B
L
L
L
H
A>B
L
L
H
L
WORD A = WORD B
WORD A > WORD B
WORD A < WORD B
1 20
DIP
PIN ASSIGNMENT
V
CC1
A>B
A<B
B0
A0
A1
B1
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
E
B2
A2
A3
B3
B4
A4
20 1
PLLC鈭?0
FN SUFFIX
CASE 775
10H166G
AWLYYWW
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb鈭扚ree Package
Pin assignment is for Dual鈭抜n鈭扡ine Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional marking information, refer to
Application Note AND8002/D.
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
漏
Semiconductor Components Industries, LLC, 2006
March, 2006
鈭?/div>
Rev. 7
Publication Order Number:
MC10H166/D
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