鈥?/div>
Pb鈭扚ree Packages are Available*
TRUTH TABLE
DATA INPUTS
D0
H
L
L
L
L
L
L
L
L
D1
X
H
L
L
L
L
L
L
L
D2
X
X
H
L
L
L
L
L
L
D3
X
X
X
H
L
L
L
L
L
D4
X
X
X
X
H
L
L
L
L
D5
X
X
X
X
X
H
L
L
L
D6
X
X
X
X
X
X
H
L
L
D7
X
X
X
X
X
X
X
H
L
OUTPUTS
Q3 Q2 Q1 Q0
H
H
H
H
H
H
H
H
L
L
L
L
L
H
H
H
H
L
L
L
H
H
L
L
H
H
L
L
H
L
H
L
H
L
H
L
16
16
1
PDIP鈭?6
P SUFFIX
CASE 648
1
MC10H165P
AWLYYWWG
DIP
PIN ASSIGNMENT
V
CC1
Q1
Q0
CLOCK
D0
D7
D1
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
Q2
Q3
D2
D5
D4
D3
D6
1 20
20 1
PLLC鈭?0
FN SUFFIX
CASE 775
10H165G
AWLYYWW
Pin assignment is for Dual鈭抜n鈭扡ine Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb鈭扚ree Package
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
漏
Semiconductor Components Industries, LLC, 2006
March, 2006
鈭?/div>
Rev. 7
1
Publication Order Number:
MC10H165/D
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