鈥?/div>
Pb鈭扚ree Packages are Available*
DIP PIN ASSIGNMENT
V
CC1
E0
Q3
Q2
Q1
Q0
A
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
E1
Pin assignment is for Dual鈭抜n鈭扡ine
C
Package. For PLCC pin assignment, see
Q4
the Pin Conversion Tables on page 18 of
Q5
16
16
1
PDIP鈭?6
P SUFFIX
CASE 648
1
MC10H161P
AWLYYWWG
10H161
ALYWG
Q6
Q7
B
the ON Semiconductor MECL Data
Book (DL122/D).
SOEIAJ鈭?6
CASE 966
1 20
LOGIC DIAGRAM
E0 2
E1 15
V
CC1
= Pin 1
V
CC2
= Pin 16
V
EE
= Pin 8
A 7
6 Q0
ENABLE
INPUTS
5 Q1
E1 E0
L
L
L
L
4 Q2
L
L
L
L
3 Q3
L
L
L
L
13 Q4
L
L
L
L
12 Q5
H X
X H
11 Q6
C 14
10 Q7
TRUTH TABLE
INPUTS
OUTPUTS
C B A Q0 Q1 Q2 Q3 Q4 Q5
L L L L H H H H H
L L H H L H H H H
L H L H H L H H H
L H H H H H L H H
H L L H H H H L H
H L H H H H H H L
H H L H H H H H H
H H H H H H H H H
X X X H H H H H H
X X X H H H H H H
20 1
PLLC鈭?0
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
10H161G
AWLYYWW
B 9
Q6
H
H
H
H
H
H
L
H
H
H
Q7
H
H
H
H
H
H
H
L
H
H
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb鈭扚ree Package
*For additional marking information, refer to
Application Note AND8002/D.
*For additional information on our Pb鈭扚ree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
漏
Semiconductor Components Industries, LLC, 2006
February, 2006
鈭?/div>
Rev. 7
1
Publication Order Number:
MC10H161/D
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