鈾?/div>
High temperature soldering in accordance with
CECC 802 / Reflow guaranteed
0.320 (8.13)
0.360 (9.14)
1
K
2
0.575 (14.60)
0.625 (15.88)
SEATING
PLATE
-T-
0.090 (2.29)
0.110 (2.79)
0.018 (0.46)
0.025 (0.64)
0.027 (0.686)
0.037 (0.940)
0.080 (2.03)
0.110 (2.79)
0.095 (2.41)
0.100 (2.54)
MECHANICAL DATA
Case:
JEDEC TO-263AB molded plastic body
Terminals:
Leads solderable per MIL-STD-750,
Method 2026
Polarity:
As marked
Mounting Position:
Any
Weight:
0.08 ounces, 2.24 gram
PIN 1
K - HEATSINK
PIN 2
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25擄C ambient temperature unless otherwise specified.
SYMBOLS
MBRB1535CT MBRB1545CT MBRB1550CT MBRB1560CT
UNITS
Maximum repetitive peak reverse voltage
Maximum working peak reverse voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
C
=105擄C
Peak repetitive forward current at T
C
=105擄C per diode
(rated V
R
, 20KH
Z
sq.wave)
Peak forward surge current 8.3ms single half sine-
wave superimposed on rated load (JEDEC method)
Peak repetitive reverse surge current
(NOTE 1)
V
RRM
V
RWM
V
DC
I
(AV)
I
FRM
I
FSM
I
RRM
35
35
35
45
45
45
15.0
15.0
150.0
1.0
_
0.57
0.84
0.72
0.1
15.0
10,000
3.0
50
50
50
60
60
60
Volts
Volts
Volts
Amps
Amps
Amps
0.5
0.75
0.65
_
_
Amps
Maximum instantaneous forward voltage
per leg at
(NOTE 2)
I
F
=7.5A,T
C
=25擄C
I
F
=7.5A,T
C
=125擄C
I
F
=15A,T
C
=25擄C
I
F
=15A,T
C
=125擄C
V
F
Volts
Maximum instantaneous reverse current at rated
DC blocking voltage per leg
T
C
=25擄C
(NOTE 2)
T
C
=125擄C
Voltage rate of change, (rated V
R
)
Maximum thermal resistance per leg
Storage temperature range
NOTES:
(1) 2.0碌s pulse width, f=1.0 KH
Z
(2) 300碌s, pulse width, 1% duty cycle
(3) Thermal resistance from junction to case per leg
I
R
dv/dt
1.0
50.0
mA
V/碌s
擄C/W
擄C
擄C
(NOTE 3)
R
螛JC
T
J
T
STG
Operating junction temperature range
-65 to +150
-65 to +175
4/98
1
2
