area. The 3
鉁?/div>
2 array of solder bumps are spaced with
a 0.5mm bump pitch.
Features
o
6-Bump, 0.5mm Pitch, UCSP (Package pending
full qualification鈥攅xpected completion date
6/30/01. See
UCSP Reliability
section for more
details.)
o
R
ON
35鈩?max (+3V Supply)
20鈩?max (+5V Supply)
o
2鈩?max R
ON
Match Between Channels
o
13鈩?max R
ON
Flatness Over Signal Range
o
Low Leakage Currents Over Temperature
1nA (max) at T
A
= +25擄C
o
Fast Switching: t
ON
= 80ns, t
OFF
= 25ns
o
Guaranteed Break-Before-Make (MAX4698)
o
+2.0V to +5.5V Single-Supply Operation
o
Rail-to-Rail
廬
Signal Handling
o
Low Crosstalk: -75dB (100kHz)
o
High Off-Isolation: -75dB (100kHz)
o
1.8V CMOS Logic Compatible
o
-3dB Bandwidth: >200MHz
MAX4696/MAX4697/MAX4698
________________________Applications
MP3 Players
Battery-Operated Equipment
Relay Replacement
Audio and Video Signal Routing
Communications Circuits
PCMCIA Cards
Cellular Phones
Hard Drives
Modems
Ordering Information
PART
MAX4696EBT
MAX4697EBT
MAX4698EBT
TEMP.
RANGE
-40擄C to +85擄C
-40擄C to +85擄C
-40擄C to +85擄C
PIN/BUMP-
PACKAGE
6 UCSP*
6 UCSP*
6 UCSP*
TOP
MARK
AAL
AAM
AAN
*Note:
Requires special solder temperature profile described
in the Absolute Maximum Ratings section.
*UCSP
reliabilty is integrally linked to the user鈥檚 assembly meth-
ods, circuit board material, and environment. Refer to the UCSP
Reliability section of this data sheet for more infromation.
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
UCSP is a trademark of Maxim Integrated Products, Inc.
Pin Configurations/Functional Diagrams/Truth Table
TOP VIEW
V+
B1
A1
NO
V+
B1
A1
NC
V+
B1
A1
NO
IN
B2
A2
COM
IN
B2
A2
COM
IN
B2
A2
COM
IN
0
NO
OFF
ON
NC
ON
OFF
GND
B3
A3
COM
GND
B3
A3
COM
GND
B3
A3
NC
1
MAX4696
MAX4697
SWITCHES SHOWN FOR LOGIC "0"
MAX4698
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim鈥檚 website at www.maxim-ic.com.