Plastic Packages for Integrated Circuits
Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
N
INDEX
AREA
E
E1
-B-
1
2
3
TOP VIEW
0.05(0.002)
-A-
D
-C-
SEATING PLANE
A
L
0.25
0.010
GAUGE
PLANE
0.25(0.010) M
B M
M28.173A
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
INCHES
SYMBOL
A
A1
A2
b
c
D
MIN
-
0.002
0.031
0.0075
0.0035
0.378
0.169
0.246
0.0177
28
0
o
-
-
8
o
0.138
0.118
0
o
-
-
MAX
0.047
0.006
0.051
0.0118
0.0079
0.386
0.177
0.256
0.0295
MILLIMETERS
MIN
-
0.05
0.80
0.19
0.09
9.60
4.30
6.25
0.45
28
8
o
3.50
3.0
MAX
1.20
0.15
1.05
0.30
0.20
9.80
4.50
6.50
0.75
NOTES
-
-
-
9
-
3
4
-
-
6
7
-
11
11
偽
A2
c
A1
0.10(0.004)
E1
e
E
L
N
0.026 BSC
0.65 BSC
e
b
0.10(0.004) M
C A M
B S
偽
1
2
3
P
P1
P1
N
P
BOTTOM VIEW
NOTES:
Rev. 1 6/99
1. These package dimensions are within allowable dimensions
of JEDEC MO-153-AET, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension 鈥淒鈥?does not include mold flash, protrusions or
gate burrs. Mold flash, protrusion and gate burrs shall not
exceed 0.15mm (0.006 inch) per side.
4. Dimension 鈥淓1鈥?does not include interlead flash or protru-
sions. Interlead flash and protrusions shall not exceed
0.15mm (0.006 inch) per side.
5. The chamfer on the body is optional. If it is not present, a vi-
sual index feature must be located within the crosshatched
area.
6. 鈥淟鈥?is the length of terminal for soldering to a substrate.
7. 鈥淣鈥?is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension 鈥渂鈥?does not include dambar protrusion. Allow-
able dambar protrusion shall be 0.08mm (0.003 inch) total
in excess of 鈥渂鈥?dimension at maximum material condition.
Minimum space between protrusion and adjacent lead is
0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch di-
mensions are not necessarily exact. (Angles in degrees)
11. Dimensions 鈥淧鈥?and 鈥淧1鈥?are thermal and/or electrical en-
hanced variations. Values shown are maximum size of ex-
posed pad within lead count and body size.
52
INTERSIL
1
