M14C32 DD
M14C32 Die Description
PRODUCT
s
WAFER SIZE
s
s
s
s
M14C32
152 mm (6 inches)
2040 x 2355 碌m
100.5 x 101.7 碌m
100 x 100 碌m
DIE IDENTIFICATION M14C32KA_R
DIE SIZE (X x Y)
SCRIBE LINE
PAD OPENING
DIE LAYOUT
s
DI
s
s
s
Die Identification (at the position shown in Figure 1)
Pad contacts to the ISO pins (at the positions shown in Figure 1)
These ISO pins do not appear on the M14C32 die
This pad, shown in Figure 1, is Not Connected
C1, C2, C3, C5, C7
C4, C6, C8
NC
Pad locations are measured relative to the die centre (where X and Y are respectively the horizontal and
vertical axis, measured in 碌m).
Figure 1. M14C32 Die Plot
C7: SDA
(X= 鈥?49.92; Y= +993.44)
C5: GND
(X= +718.0; Y= +1010.0)
DI
NC: TEST
NC: TEST
C3: SCL
(X= 鈥?37.28; Y= 鈥?04.24)
AI02495
NC: TEST
C2: WC
(X= 鈥?48.48; Y= 鈥?93.6)
C1: VCC
(X= +650.08; Y= 鈥?93.76)
DD.M14C32/9811V1.1
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