LX3044 / 45 / 46
I N T E G R A T E D
P R O D U C T S
10.3 Gbps Coplanar GaAs PIN Photo Diode
P
RODUCTION
D
ATA
S
HEET
DESCRIPTION
KEY FEATURES
LX3044 Single Die
LX3045, 1x4 Array Die
LX3046, 1x12 Array Die
Coplanar Waveguide , 50ohm
High Responsivity
Low Dark Current
High Bandwidth
Anode/Cathode on Illuminated
Side
125mm Pad pitch
Die Good for Bond Wire or Flip
Chip Applications
APPLICATIONS
Microsemi鈥檚 GaAs Coplanar PIN
Photo Diode chips are ideal for high
bandwidth 850nm optical networking
applications.
The device family offers superior
noise performance and sensitivity in
single die, 1x4 array die or 1x12 array
die.
The LX304X family of photo diodes
are currently offered in die form
allowing manufacturers the versatility
of custom assembly using either bond
wire or flip chip configurations.
This
device
is
ideal
for
manufacturers of optical receivers,
transponders,
optical
transmission
modules and combination PIN photo
diode 鈥?transimpedance amplifier.
WWW .
Microsemi
.C
OM
IMPORTANT:
For the most current data, consult
MICROSEMI鈥檚
website:
http://www.microsemi.com
Short Reach Optical Networks
10Gigabit Ethernet, Fibre
Channel
VCSEL Array Receiver
BENEFITS
Large Wirebond Contact Pads
Low Contact Resistance
PRODUCT HIGHLIGHT
Coplanar Design (gnd-signal-gnd) 50 ohm
characteristic impedance
125 um standard pad pitch for ease of test
Large 75um x 75um pad size for ease of
packaging
Wire bond or Flip Chip capability
Single Die
1x4 Die
1x12 Die
PACKAGE ORDER INFO
Die Dimension
1
Pad Dimension
1
Active Area, A
Pad Pitch, p
1
Die Thickness
1
(碌m)
(碌m)
(碌m)
(碌m)
(碌m)
LX304
X
LX304
X
T
J
(擄C)
0 to 70
Die
Die
LX3044
LX3045
LX3046
75
Y
450
450
450
X
450
1200
3200
w
75
75
75
v
75
75
75
125
125
125
152
203
203
1. See Package Dimensions (page 4)
Note: Available in Tape & Reel. Append the letter 鈥淭鈥?to the part number. (i.e. LX3044T)
Copyright
錚?/div>
2000
Rev. 1.0, 2002-10-29
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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