HOLOGRAM LASER
Hologram Laser(3 beam) for MD players
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Features
(1) Enables to design compact pick-up thanks to
compact package. (Thickness; 4.8mm)
(2) Since its semiconductor laser, signal detection
photocell, and circuit array are assembled in a
package, the optical pick is simple in assembling
and adjustment
(3) The adjustment during pickup assembly is eased
and can easily be automated.
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LT0H33P
Outline Dimensions
蠁
8.2
(Unit: mm)
4.8
0.25
MIN.
0.25
MIN.
蠁
6.63
Hologram glass
Cap glass
3.97
3.2
0.25
2.0
4.77
Reference surface
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Applications
(1) MD players
8.2
10
-
蠁
0.4
P1.4
鹵
0.2 X 3 = 4.2
鹵
0.2
1
2
3
4
2.8
9
8
7
6
4.9
[Terminal connection]
LT0H33P
10
Laser diode
5
2
G
9: NC
1
D1
3
4
D2
6
4.8
10
5
4.6
1.2
D3
8
0.3
MAX.
1.27
LD chip
D4
7
D5
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Absolute Maximum Ratings
Parameter
Symbol
Ratings
Units
Optical power output *1
P
O
7.0
mW
Laser
2
Reverse Monitor photodiode
V
R
30
V
voltage
Photodiode for signal detection
15
Operating temperature*2
Topr
-25 to +70
藲C
Storage temperature *2
Tstg
-40 to +85
藲C
Soldering temperature *3
Tsol
260(5s or less)
藲C
*1 Output power from hologram laser
*2 Case temperature
*3 At the position of 1.6mm from the
bottom face of resin package.
(Notice)
鈥?In the absence of device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices
shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
鈥?Specifications are subject to change without notice for improvement.
(Internet)
鈥?Data for Sharp's optoelectronic/power devices is provided for internet. ( Address http://www.sharp.co.jp/ecg/)
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