LM2501 Mobile Pixel Link (MPL) Camera Interface Serializer and Deserializer
ADVANCE INFORMATION
June 2004
LM2501
Mobile Pixel Link (MPL) Camera Interface Serializer and
Deserializer
General Description
The LM2501 device is a Serializer/Deserializer that adapts
existing video busses to Mobile Pixel Link (MPL). MPL is
intended to replace wide LVCMOS video interfaces inside
portable electronics equipment benefiting their cost, size,
EMI and power consumption.
By using the LM2501 SERDES chipset, the interconnect is
reduced from 12 active signals to only 3 active signals
providing a 75% reduction. This eases interconect and flex
design, size and cost.
Contained in a 24 lead Ultra Thin CSP Package, the Serial-
izer resides beside the video source (camera) and translates
the parallel bus from LVCMOS levels to serial MPL levels for
transmission over a flex cable to the Deserializer located by
the respective destination Video Input Port.
An extra clock transport is provided to deliver a clock signal
to the target. For example, from the main board to the flip
board where the camera module is located. Transmission of
the clock also benefits from MPL鈥檚 low power transmission
and low EMI.
The Power_Down (PD*) input controls the power state of the
MPL interface. When PD* is asserted, the MD, MC and WC
signals are powered down to save current and reduce power
dissipation.
Features
n
n
n
n
n
160 Mbps Raw Throughput
MPL-0 Meets MPL Physical Layer Specification
Configurable as a Serializer or Deserializer
Complete LVCMOS to MPL Translation
Serializes 8-bit Camera Interface
鈥?8-bit color data
鈥?plus VSYNC and HSYNC bits
Link power down mode reduces quiescent power under
鈭?/div>
10 碌A(chǔ) (actual TBD)
1.7V鈥?.1V and 2.9-3.1V Supply Voltage
Interfaces to 1.8V鈥?.0V Logic
Offered in a small 24L UCSP Package
鈥?3.5 mm X 4.5 mm
鈥?0.6 mm Max Height
n
n
n
n
System Benefits
n
n
n
n
n
Reduced Wire Interface
Low Power
Low EMI
Extra Clock Transport
Intrinsic Level Translation
Typical Application Diagram
20091601
Ordering Information
NSID
LM2501SL
Package Type
24-Lead Ultra Thin CSP 3.5 X 4.5 X 0.6 mm
Package ID
SLE24A
I2C
廬
is a registered trademark of Phillips Corporation.
漏 2004 National Semiconductor Corporation
DS200916
www.national.com
next