鈻?/div>
Flexible Programming, Recon鏗乬uration,
and Testing
鈥?IEEE 1532 and 1149.1 compliant
鈥?Microprocessor con鏗乬uration interface
鈥?Program E
2
CMOS while operating from SRAM
鈥?Multiple sysMEM Embedded RAM Blocks
鈥?Single port, Dual port, and FIFO operation
鈥?64-bit distributed memory in each PFU
鈥?Single port, Double port, FIFO, and Shift
Register operation
Table 1. ispXPGA Family Selection Guide
ispXPGA 125
System Gates
PFUs
LUT-4s
Logic FFs
sysMEM Memory
Distributed Memory
EBR
sysHSI Channels
User I/O
Packaging
139K
484
1936
3.8K
92K
30K
20
4
160/176
256 fpBGA
516 fpBGA
1
ispXPGA 200
210K
676
2704
5.4K
111K
43K
24
8
160/208
256 fpBGA
516 fpBGA
1
ispXPGA 500
476K
1764
7056
14.1K
184K
112K
40
12
336
516 fpBGA
1
900 fpBGA
1. Thermally enhanced package.
ispXPGA 1200
1.25M
3844
15376
30.7K
414K
246K
90
20
496
680 fpSBGA
1
900 fpBGA
Note: LFX1200B/C is preliminary, LFX125/200/500B/C information is advanced.
漏 2003 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The speci鏗乧ations and information herein are subject to change without notice.
www.latticesemi.com
1
xpga_04