鈥?/div>
High-luminous-flux output for illumination
Exposed-pad design for excellent heat transfer
Designed for high-current operation
Reflow soldering applicable
Absolute Maximum Ratings (T
A
= 25擄C)
Items
Forward Current
Peak Forward Current
Reverse Voltage
Power Dissipation
Operation Temperature
Storage Temperature
Junction Temperature
Junction-to-Ambient
Junction-to-Case
Note 2
Note 1
Symbol
I
F
I
FP
V
R
P
D
T
opr
T
stg
T
J
胃
JA
胃
JC
Absolute Maximum Rating
100
150
5
480
-40 ~ +85
-40 ~ +85
110
135
70
Unit
mA
mA
V
mW
擄C
擄C
擄C
擄C/W
擄C/W
Note 2
1.
2.
Notes:
Pulse width 鈮?.1 msec, duty 鈮?/10.
Rth test condition: mounted on 1.7 mm, Al-based PCB in size of 12 x 12 mm
Typical Electrical & Optical Characteristics at T
A
= 25擄C (on metal core PCB)
Characteristics
Forward Voltage
Reverse Current
Symbol
V
F
I
R
位
D
lumen
2胃錕?frac12;H-H
2胃錕?frac12;V-V
Condition
I
F
= 100 mA
V
R
= 5 V
I
F
= 100 mA
I
F
= 100 mA
I
F
= 100 mA
I
F
= 100 mA
Unit
V
渭A
nm
lm
deg
deg
495
3
505
4.5
125
115
Minimum
Typical
4.0
Note
Maximum
4.8
10
510
LD-CT139.000
Data Sheet: C
Dominant Wavelength
Luminous Flux
50% Power Angle
Note: A
metal core PCB has an effective heat-transmission substrate (thickness of 1.7 mm, Al-based PCB in 12 x
12 mm, 胃
JC
<50擄C/W should suffice).
Subject to change without notice.
www.cree.com/ledlamps
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