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Content
Application and Handling Instructions...................................................................................................................... 2
Further application support ...................................................................................................................................... 2
General Description................................................................................................................................................. 2
Features of SKYPER鈩?32PRO............................................................................................................................... 2
Block diagram.......................................................................................................................................................... 3
Dimensions.............................................................................................................................................................. 3
PIN Array 鈥?Primary Side......................................................................................................................................... 4
PIN Array 鈥?Secondary Side.................................................................................................................................... 5
Driver Performance ................................................................................................................................................. 6
Insulation ................................................................................................................................................................. 6
Auxiliary Power Supply............................................................................................................................................ 6
Under Voltage Reset (UVR) .................................................................................................................................... 7
Under Voltage Protection (UVP) primary................................................................................................................. 8
Under Voltage Protection secondary ....................................................................................................................... 8
Input Signals............................................................................................................................................................ 8
Short Pulse Suppression (SPS)............................................................................................................................... 9
Failure Management................................................................................................................................................ 9
Halt Logic Signal (HLS) ........................................................................................................................................... 9
Dead Time generation (Interlock TOP / BOT) adjustable (DT) .............................................................................. 10
Dynamic Short Circuit Protection by V
CEsat
monitoring / de-saturation monitoring (DSCP).................................... 11
Adjustment of DSCP.............................................................................................................................................. 12
High Voltage Diode for DSCP................................................................................................................................ 12
Gate resistors ........................................................................................................................................................ 13
Soft Turn-Off (STO) ............................................................................................................................................... 13
External Error Input (EEI) ...................................................................................................................................... 14
Application Example .............................................................................................................................................. 14
Mounting Notes ..................................................................................................................................................... 15
Marking.................................................................................................................................................................. 16
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. Furthermore, this technical
information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or
implied is made regarding delivery, performance or suitability. Specifications mentioned in this document are subject to
change without notice. This document supersedes and replaces all information previously supplied and may be supersede
by updates.
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2005-06-03 鈥?Rev02
漏 by
SEMIKRON
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