< 10 碌s; rep. rating, pulse width limited by T
N/lb.
鈮?/div>
1 mA
typical
165
2.5
10...50/2...10
6
Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
Low cathode to tab capacitance (<25pF)
International standard package
Planar passivated chips
Very short recovery time
Extremely low switching losses
Low I
RM
-values
Soft recovery behaviour
Epoxy meets UL 94V-0
Isolated and UL registered E153432
Mounting force with clip
Applications
q
q
q
q
Symbol
I
R
x
Conditions
T
VJ
= 25擄C V
R
= V
RRM
T
VJ
= 150擄C V
R
= V
RRM
I
F
= 30 A;
T
VJ
= 150擄C
T
VJ
= 25擄C
Characteristic Values
typ.
max.
250
2
3.1
5.0
0.9
0.25
20
4.0
碌A(chǔ)
mA
V
V
K/W
K/W
ns
q
q
q
q
V
F
y
R
thJC
R
thCH
t
rr
I
RM
Antiparallel diode for high frequency
switching devices
Antisaturation diode
Snubber diode
Free wheeling diode in converters
and motor control circuits
Rectifiers in switch mode power
supplies (SMPS)
Inductive heating
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
Advantages
q
with heatsink compound
I
F
= 1 A; -di/dt = 200 A/碌s;
V
R
= 30 V; T
VJ
= 25擄C
V
R
= 100 V; I
F
= 50 A; -di
F
/dt = 100 A/碌s
T
VJ
= 100擄C
q
q
A
Pulse test:
x
Pulse Width = 5 ms, Duty Cycle < 2.0 %
y
Pulse Width = 300 碌s, Duty Cycle < 2.0 %
Data according to IEC 60747 and per diode unless otherwise specified
q
Avalanche voltage rated for reliable
operation
Soft reverse recovery for low EMI/RFI
Low I
RM
reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating
switch
ISOPLUS 247
TM
package for clip or
spring mounting
Dimensions see IXYS CD 2000
008
IXYS reserves the right to change limits, test conditions and dimensions.
漏 2000 IXYS All rights reserved
1-1
IXYS
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