鈻?/div>
Improved die-to-footprint ratio
Very low profile package (1mm max)
Very low thermal resistance
Conduction losses reduced
Switching losses reduced
PowerFLAT鈩? 6x5 )
Description
This series utilizes the last advanced design rules
of ST鈥檚 proprietary STripFET鈩?technology. This
process complete to unique metallization
technique realised the most advanced low voltage
Power MOSFET in PowerFLAT鈩?6x5). The Chip-
scaled PowerFLAT鈩?package allows a significant
board space saving, still boosting the
performance.
Internal schematic diagram
Applications
鈻?/div>
Switching application
Order codes
Part number
STL100NH3LL
Marking
L100NH3LL
Package
PowerFLAT鈩?(6x5)
Packaging
Tape & reel
January 2007
Rev 9
1/12
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