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KGF1323 Datasheet

  • KGF1323

  • Power FET(Plastic Package Type)

  • 7頁(yè)

  • OKI

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E2Q0030-38-72
隆 electronic components
This version: Jul. 1998
Previous version: Jan. 1998
KGF1323
隆
electronic components
KGF1323
Power FET(Plastic Package Type)
GENERAL DESCRIPTION
The KGF1323, housed in a SOT-89 type plastic-mold package, is a discrete UHF-band power FET
that features high efficiency and high output power. The KGF1323 specifications are guaranteed
to a fixed matching circuit for 5.8 V and 850 MHz; external impedance-matching circuits are also
required. Because of its high efficiency, high output power (more than 33 dBm), and plastic
package, the KGF1323 is ideal as a transmitter-final-stage amplifier for personal handy phones,
such as TDMA-type cellular phones.
FEATURES
鈥?High output power: 33 dBm (min.)
鈥?High efficiency: 70% (typ.)
鈥?Low thermal resistance: 23擄C/W (typ.)
鈥?Package: 3PMMP (SOT-89 type)
PACKAGE DIMENSIONS
4.5
鹵
0.1
1.6
+0.15
鈥?.10
1.5
鹵
0.1
2.5
鹵
0.1
1
鹵
0.2
4
鹵
0.2
0.48
+0.08
鈥?.05
0.4
+0.08
鈥?.05
1.5
鹵
0.1 1.5
鹵
0.1
3
鹵
0.1
0.4
+0.08
鈥?.05
0.39
鹵
0.05
Package material
Lead frame material
Pin treatment
Solder plate thickness
Epoxy resin
Cu
Solder plating
5
mm
or more
(Unit: mm)
1/7

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