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KAB04D100M-TLGP Datasheet

  • KAB04D100M-TLGP

  • Multi-Chip Package MEMORY

  • 72頁(yè)

  • SAMSUNG   SAMSUNG

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KAB0xD100M - TxGP
Document Title
Multi-Chip Package MEMORY
SEC Only
MCP MEMORY
64M Bit (8Mx8/4Mx16) Dual Bank NOR Flash / 128M Bit (8Mx16) NAND Flash / 32M Bit (2Mx16) UtRAM
Revision History
Revision No. History
0.0
0.1
Initial Draft
Inserted No ECC condition in NAND Flash
鈥?/div>
Endurance (1page)
: 1,000 Program/Erase Cycles Maximum without ECC
鈥?/div>
Program Flow (39page)
: Excluded "Read Verify" step after programming in this condition
<Common>
Revised T
BIAS
(43page)
鈥?/div>
from "-25 to 85" to "-40 to 125"
Revised V
IL
(43page)
鈥?/div>
from max. 0.6V to max. 0.5V
Revised V
OH
(43page)
鈥?/div>
from min. 2.4V to min. 2.3V
Revised IOL(43page)
鈥?/div>
from 0.1mA to max. 2.1mA
Revised IOH(43page)
鈥?/div>
from -0.1mA to max. -1.0mA
<NAND>
Revised the internal voltage that disables all functions(37page)
鈥?/div>
from 2V to 1.3V
Revised power-up and power-down recovery time(37page)
鈥?/div>
from min. 1碌s to min. 10碌s
Revised write cycle time(tWC)(59page)
鈥?/div>
from 50ns to min. 45ns
Combined ALE to RE Delay in ID read and in Read cycle(59page)
鈥?/div>
from min. 20ns and 50ns to min. 10ns
Revised RE Access Time(t
REA
)(59page)
鈥?/div>
from max. 35ns to max. 30ns
Excluded min. value of RE High to Output Hi-Z(t
REH
)(59page)
Inserted RE or CE
F
High to Output Hold(t
OH
) with min. 15ns(59page)
Revised timing diagram
Finalize
Revised <NOR>
- Release the stand-by current from typ. 5uA(max. 18uA) to typ.
10uA(max. 30uA).
Revised <NAND>
- Corrected Some typos in the timing diagram
Draft Date
March 20, 2002
March 28, 2002
Remark
Preliminary
Preliminary
0.2
March 28, 2002
Preliminary
0.3
June 17, 2002
Final
1.0
1.1
October 15, 2002
June 18, 2003
Final
Final
1.11
August 14, 2003
Final
Note : For more detailed features and specifications including FAQ, please refer to Samsung鈥檚 web site.
http://samsungelectronics.com/semiconductors/products/products_index.html
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have
any questions, please contact the SAMSUNG branch office near you.
-1-
Revision 1.11
August 2003

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