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3-State Outputs Drive Bus Lines Directly
Package Options Include Plastic
Small-Outline (SOIC) and Shrink
Small-Outline (SSOP) Packages, Ceramic
Chip Carriers, and Plastic and Ceramic
DIPs
SN54F245 . . . J PACKAGE
SN74F245 . . . DB, DW, OR N PACKAGE
(TOP VIEW)
description
These octal bus transceivers are designed for
asynchronous communication between data
buses. The devices transmit data from the A bus
to the B bus or from the B bus to the A bus
depending upon the logic level at the
direction-control (DIR) input. The output enable
(OE) input can be used to disable the device so the
buses are effectively isolated.
The SN74F245 is available in TI鈥檚 shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
The SN54F245 is characterized for operation over
the full military temperature range of 鈥?55擄C to
125擄C. The SN74F245 is characterized for
operation from 0擄C to 70擄C.
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
OE
B1
B2
B3
B4
B5
B6
B7
B8
SN54F245 . . . FK PACKAGE
(TOP VIEW)
A2
A1
DIR
V
CC
A3
A4
A5
A6
A7
4
5
6
7
8
3 2 1 20 19
18
17
16
15
14
9 10 11 12 13
OE
B1
B2
B3
B4
B5
FUNCTION TABLE
INPUTS
OE
L
L
H
DIR
L
H
X
OPERATION
B data to A bus
A data to B bus
Isolation
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
漏
1993, Texas Instruments Incorporated
POST OFFICE BOX 655303
鈥?/div>
DALLAS, TEXAS 75265
A8
GND
B8
B7
B6
2鈥?
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